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Complex Insert Molding & Lead Frame Assemblies

Methode’s stamping and complex insert molding design and manufacturing capabilities allow interconnect systems to be integrated into a single lead frame assembly. Lead frames are designed to specific customer requirements and can incorporate electronic components, such as sensors or circuitry. Designs can meet stringent environmental demands, such as extreme temperature, fluid exposure and vibration. Another major benefit is the reduction of electrical connections, which improves overall reliability.

 

Applications

  • Wire bonded microcircuits
  • Integrated electro-mechanical assemblies
  • Signal and power circuits
  • Switch contact systems
  • Integrated control units
  • Sensors

Industries

  • Automotive
  • Medical
  • Industrial
  • Data communications
  • And many more...

Bibliothèque technique

Complex Insert Molding Lead Frame Assemblies Data Sheet

[PDF 2.97 MB]

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